|
|
Single Sided
|
Prototype & mid volume (<1000 pcs)
|
|
Double Sided
|
Prototype & small volume (<500 pcs)
|
|
Multilayer
|
Prototype only (<10 pcs)
|
|
Soldermask
|
Dry film or LPI applied as SMOBC.
|
|
Legend Print
|
LPI, Screen Print (white epoxy)
|
|
Surface Finishing
|
Electroless copper, Electroless nickel,
Immersion Gold, Electroless Nickel Immersion Gold
(ENIG).
|
|
Lead Free finish
|
proprietary process.
|
|
Processes
|
12 mils, 10 mils, 5 mils, 2 mils*
|
|
Copper Thickness
|
No limit, dependent upon trace width
|
|
Photoplotting
|
8000 DPI , up to 30"x42" Infra-red
Film
|
|
Repeatability -Imaging
|
1/10 th mil
|
|
Repeatability -Drill
|
±1 mil X and Y axis
|
|
Repeatability - Routing
|
±10 mils
|
|
Top/bottom alignment
|
± 2 mils
|
|
Dimensional Accuracy
|
±0.001% on X axis (1/100,000 mil)
±0.1% x on Y axis (1/1000 mil)
|
*Proprietary Full Addictive Process
Listed
above is our standard capabilities. We are also in the R&D stage of more
advanced capabilities like 2mil trace/separation as well as very fine 10 oz
boards.
We have a complete set of PCB fabrication machineries.
These machineries are specially designed for small volume fabrication
requirements. As we strive to achieve better standards, we are constantly
adding more equipment to our list.
|
Type
|
Model
|
Manufacturer
|
|
CNC Drill
|
CCD MTC
|
Bungard, Germany
|
|
CNC Router
|
XenPCB
|
Xenon, Cypruss
|
|
Photoplotter
|
Avantra 30
|
Agfa, Belgium
|
|
Spray Etcher
|
Jet34D XXL
|
Bungard, Germany
|
|
Spray Developer
|
Jet34D Ver
2
|
Bungard, Germany
|
|
UV exposure
|
Hellas
|
Bungard, Germany
|
|
PTH System
|
FlashPlate
|
JTK, Taiwan
|
|
Brushing Machine
|
Vac-Srub
|
JTK, Taiwan
|
|
Laminator
|
NE 2320
|
Han Kook, Korea
|
|
Shears
|
MS-6
|
Kepro Circuits, USA
|
|
Infra-Red Curing
|
BTO-102
|
Kepro Circuits, USA
|
This is our normal process cycle -
we can alter the process cycle according to product requirement (eg. Gold Finish). These all detailed steps ensures
highest quality PCB with low reject rates.
|
1. Drilling
|
15. Laminate Surface Etch
|
|
2. Deburring
|
16. Soldermask
Application
|
|
3. Desmear
|
17. Soldermask
Oven Cure
|
|
4. Micro-etch
|
18. Soldermask
Exposure
|
|
5. Sensitizing
|
19. Spray developing
|
|
6. Activating
|
20. Soldermask
Hardening
|
|
7. Plated Through Hole
|
21. Silkscreen Application
|
|
8. Photoresist
Lamination
|
22. Silkscreen Oven Cure
|
|
9. Photoresist
Exposure
|
23. Silkscreen Exposure
|
|
10. Spray Developing
|
24. Spray developing
|
|
11. Spray Etching
|
25. Silkscreen Hardening
|
|
12. Spray Stripping
|
26. Copper Pads cleaning
|
|
13. Anti-Tarnish Bath
|
27. Immersion Tin/Silver
|
|
14. Surface Cleaning
|
28. Panel routing.
|
|
|
|
Type
|
Function
|
Manufacturer
|
|
Drill Bits
|
Drilling
|
HAM, Germany
|
|
Infrared Films
|
Photoplot Master
|
Kodak, USA
|
|
OrthoLith FIlms
|
Negative Duplicates
|
Kodak, USA
|
|
Diazo Films
|
Positive Duplicates
|
Aazon, USA
|
|
Soldermask
|
Dry Film Soldermask
|
Dupont, USA
|
|
Photoresist
|
Dry Film Photoresist
|
Dupont, USA
|
|
Soldermask
|
LPI Soldermask
|
Fotochem, Taiwan
|
|
Soldemask
|
Dry Film Soldermask
|
Shipley Ronal
|
|
Laminates
|
FR4, FR1, CEM-1.
|
Nanmei, China
|
|
Laminates
|
FR4-2, FR2, CEM-2
|
Kingboard, Taiwan
|
|
Electroless Copper
|
Copper Plating
|
JTK
|
|
Electroless Nickel
|
Nickel Plating
|
JTK
|
|
Electroless Gold
|
Gold Plating
|
JTK
|
|
Immersion
Tin
|
Tin Plating
|
JTK
|
|
Immersion Silver
|
Silver Plating
|
JTK
|
|
Surface Activation
|
Through Hole Plating
|
JTK
|
|
Electroless Control
|
Electroless Metal Deposition
|
JTK
|
Jentek Technology specializing in
metal finishing chemicals. We are a handful of chemically self-sufficient
manufacturers in this industry
|
Supply Type
|
Supplier
|
|
Industrial Chemicals
|
KLH Chemicals, Malaysia
|
|
Industrial Chemicals
|
Prima Chemicals, Malaysia
|
|
R&D Lab Supplies
|
Chemolab Supplies, Malaysia
|
|
Copper Clad Laminates
|
Nanmei Technologies, Malaysia
|
|
Fabrication Consumables
|
Bungard, Germany
|
|
